Odisha set to house India’s first, advanced, 3D chip-packaging unit
- Apr 20, 2026
A foundation stone for the country’s first, advanced, 3D chip-packaging unit has been laid at Info Valley in Bhubaneswar, Odisha.The project marks...
A foundation stone for the country’s first, advanced, 3D chip-packaging unit has been laid at Info Valley in Bhubaneswar, Odisha.The project marks...